
ESD5Z2.5T1G Series, SZESD5Z2.5T1G Series
MAXIMUM RATINGS
Rating
IEC 61000 ? 4 ? 2 (ESD)
Contact
Air
IEC 61000 ? 4 ? 4 (EFT)
ESD Voltage
Per Human Body Model
Per Machine Model
Total Power Dissipation on FR ? 4 Board (Note 1) @ T A = 25 ° C
Junction and Storage Temperature Range
Lead Solder Temperature ? Maximum (10 Second Duration)
Symbol
° P D °
T J , T stg
T L
Value
± 30
± 30
40
16
400
500
? 55 to +150
260
Unit
kV
A
kV
V
mW
° C
° C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. FR ? 4 printed circuit board, single ? sided copper, mounting pad 1 cm 2 .
See Application Note AND8308/D for further description of survivability specs.
ELECTRICAL CHARACTERISTICS
(T A = 25 ° C unless otherwise noted)
Symbol Parameter
I PP Maximum Reverse Peak Pulse Current
V C
Clamping Voltage @ I PP
V RWM
Working Peak Reverse Voltage
I F
I
I R V F
I R
V BR
Maximum Reverse Leakage Current @ V RWM
Breakdown Voltage @ I T
V C V BR V RWM
I T
V
I T
I F
Test Current
Forward Current
V F
P pk
C
Forward Voltage @ I F
Peak Power Dissipation
Max. Capacitance @V R = 0 and f = 1 MHz
I PP
Uni ? Directional TVS
*See Application Note AND8308/D for detailed explanations of
datasheet parameters.
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